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Balthazor

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Posts posted by Balthazor


  1. senang cite la..bende² combo nih biasenye performance mmg x sepower yg biase kite pakai..

    klu nk stability,reability,performance cun amik la jenis Abit,Asus,Gigabyte,MSI (Platinum & Diamond Edition)

    Sebut mobo Gigabyte..............dia ada DPS(dual Power SYSTEM).......apa kebende tu....adik beradik ngan MSI Corecell ke..................?


  2. emm...

    kalau yang onboard display memang tak leh celen yang gc nye..

    sbb kat situ die dah kacau sedikit sistem memory untuk dikongsi dengan display onboard..

    kalau la mobo bagi built in display sepower dengan gc..

    leps ni tak payah lagi kuar gc..

    terus jek letak kat mobo.. biggrin.gif

    yang pasal intel tu..

    memang tak di nafikan..

    intel based chipset..(i9xx)

    die punya display lagi cun dari onboard yang lain.. biggrin.gif

    okay...macam mana dengan ATI XPRESS200 pun ada 9600 iGP based on 9600 core........semua gamers tahu card radeon 9600 cam mana.....sekarang nak beli pun harga RM4xx.......


  3. JENIS-JENIS VIRUS BIASA

    BOOT SECTOR

    Menduduki sebahagian daripada bahagian cakera keras atau disket pada bahagian rekod boot utama(MBR).Virus ini akan memasuki ingatan , sebelum perisian antivirus dapat berfungsi kerana ia aktif sebaik sahaja komputer dihidupkan .Ia akan mendiamkan dirinya ssehingga ia dihidupkan oleh aturcara tersebut.Pencegahan virus ini kurang berkesan kerana virus ini akan bergerak aktif bila setiap kali komputer dihidupkan dan setiap kali perisian digunakan .Virus ini juga boleh berpindah ke komputer lain apabila cakera liut yang mengandungi virus digunakan untuk menghidupkan komputer.Namun ia semakin berkurangan pada hari ini kerana kebanyakkan komputer baru tidak memerlukan `boot disk ‘ untuk dihidupkan.

    macam mana virus jenis Signature,SAndbox dan Heuristic?


  4. Tak power....................Built in R9100 IGP bleh support Pixel Shader 2.0.......sama ngan features yang ada kat radeon 9200....walaupun kedua2 kad vga support only Directx 8.1................?tapi lagi baik drpd Intel Extreme 2 yg aada kat intel chipset?


  5. Topics > Components > Chips > CPUs >

    Via Develops Twin-Core Processor

    Processor could steal spotlight from AMD, Intel's forthcoming dual-core chips.

    Sumner Lemon, IDG News Service

    Tuesday, October 26, 2004

    In a move that could upstage the dual-core processor plans of Advanced Micro Devices and Intel, Via Technologies is developing a twin-core x86 processor that is likely to hit the market by June 2005.

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    A launch in June would give Via a shot at being the first company to introduce an x86 processor with two cores.

    "We're pretty confident we'll have something by the end of Q2 next year," said Richard Brown, Via's associate vice president of marketing, in Taipei.

    Twin Power

    The twin-core processor is primarily designed to be used in high-density server clusters. Via has demonstrated that two processors can fit onto a small Mini-ITX motherboard and it will be feasible for customers to offer a standard 1U server chassis containing two Mini-ITX motherboards running four twin-core processors, Brown said.

    Via's twin-core processor contains two pieces of silicon--each with one Esther processor core on it--inside a single chip package, Brown said. By comparison, dual-core processors, which are being developed by AMD and Intel, put two cores on a single piece of silicon. Via also has plans to offer a dual-core chip, but that product is not expected to be available any time soon.

    Announced in May, the Esther cores are manufactured by IBM using a 90-nanometer process. The 32-bit chips consume 3.5 watts when running at a clock speed of 1 GHz and will run at a clock speed of up to 2 GHz. Esther also incorporates Via's PadLock security technology that offers hardware-accelerated RSA encryption and support execution protection antivirus technology.

    Via has not finalized the clock speed of the cores that will be used in the twin-core chips, Brown said.

    Production Challenges

    Putting two cores, each on a separate piece of silicon, inside of a single package is not a simple endeavor, and Via is currently working through issues such as heat and interference that must be resolved for the chip to work properly, Brown said. However, Via is confident these issues will be resolved, he said, noting that the dual-core approach presents its own set of challenges.

    One of those challenges is production yield, Brown said. With two cores on each silicon chip, there is a greater chance that something can go wrong and the chips will not meet the required performance specifications.

    Via chose the twin-core design because it will allow the company to more quickly bring to market a processor with two cores, Brown said. The company doesn't believe that a significant performance difference currently exists between the two approaches, he said.

    Pricing for the chip has not yet been set. "The pricing will be affordable but we're not going to go ultra low cost," Brown said.

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